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기록
DESIGN AND STRUCTURES OF HIGH-SPEED INTERCONNECTS FOR IMPROVED SIGNAL INTEGRITY
발명심사 중
3조회수
20청구항 · 2 독립항
§ Ⅰ
개요
발명자
Guoan Wang; Yingcong Zhang
IPC 분류
H1P 3/8H1P 5/18H1P 11/H3H 7/1
CPC 분류
H1P3/81H1P5/185H1P11/3H3H7/1791
An improved design methodology and new interconnect structures, which includes integrating interdigital trapezoidal tabs and defected microstrip line to effectively reduce far-end crosstalk including a new design method and unique structures aimed at enhancing signal integrity.
원문 (중국어)
An improved design methodology and new interconnect structures, which includes integrating interdigital trapezoidal tabs and defected microstrip line to effectively reduce far-end crosstalk including a new design method and unique structures aimed at enhancing signal integrity.