OSCILLATOR AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE
개요
발명자
TINGYI CHEN
IPC 분류
CPC 분류
An oscillator and a manufacturing method thereof are provided. The oscillator includes a resonator, an oscillation chip, an insulating layer and a first electrode structure. The resonator includes a vibrating element and an airtight packaging structure packaged around the vibrating element. The oscillation chip is arranged on one side of the airtight packaging structure. The insulating layer covers at least one side of the oscillation chip and at least one side of the airtight packaging structure. The insulating layer has a first via hole, and a conductive material is provided in the first via hole. The first electrode structure is arranged on the insulating layer and electrically connected to the oscillation chip through the conductive material inside the first via hole.
원문 (중국어)
An oscillator and a manufacturing method thereof are provided. The oscillator includes a resonator, an oscillation chip, an insulating layer and a first electrode structure. The resonator includes a vibrating element and an airtight packaging structure packaged around the vibrating element. The oscillation chip is arranged on one side of the airtight packaging structure. The insulating layer covers at least one side of the oscillation chip and at least one side of the airtight packaging structure. The insulating layer has a first via hole, and a conductive material is provided in the first via hole. The first electrode structure is arranged on the insulating layer and electrically connected to the oscillation chip through the conductive material inside the first via hole.