SEMICONDUCTOR DEVICE
개요
발명자
Junichi SEKITO
IPC 분류
CPC 분류
A semiconductor device includes a first chip and a second chip. Each chip includes a high-side pad that receives a high-side voltage, a low-side pad that receives a low-side voltage, two or more control pads, an input pad, an output pad, and a functional circuit. In each chip, the two or more control pads are each pulled down to the low-side voltage or pulled up to the high-side voltage. In each chip, the two or more control pads include a target control pad that receives an external control signal. In each chip, an internal control signal is generated on the basis of two or more signals applied to the two or more control pads, and an operation of the functional circuit is controlled on the basis of the internal control signal.
원문 (중국어)
A semiconductor device includes a first chip and a second chip. Each chip includes a high-side pad that receives a high-side voltage, a low-side pad that receives a low-side voltage, two or more control pads, an input pad, an output pad, and a functional circuit. In each chip, the two or more control pads are each pulled down to the low-side voltage or pulled up to the high-side voltage. In each chip, the two or more control pads include a target control pad that receives an external control signal. In each chip, an internal control signal is generated on the basis of two or more signals applied to the two or more control pads, and an operation of the functional circuit is controlled on the basis of the internal control signal.