APPARATUS AND DEVICES FOR CHIP-TO-CHIP COMMUNICATION
개요
출원인
Intel Corporation
발명자
Shuhei YAMADA; Tae Young YANG; Zhen ZHOU; Tolga ACIKALIN; Kenneth P. FOUST; Bryce D. HORINE
IPC 분류
CPC 분류
An integrated circuit device including: a plurality of integrated circuit dies, wherein each integrated circuit die of the plurality of integrated circuit dies is configured to receive or transmit a respective baseband signal; and a further integrated circuit die including: a plurality of front-end circuits, wherein each front-end circuit of the plurality of front-end circuits is coupled to a respective integrated circuit die of the plurality of integrated circuit dies.
원문 (중국어)
An integrated circuit device including: a plurality of integrated circuit dies, wherein each integrated circuit die of the plurality of integrated circuit dies is configured to receive or transmit a respective baseband signal; and a further integrated circuit die including: a plurality of front-end circuits, wherein each front-end circuit of the plurality of front-end circuits is coupled to a respective integrated circuit die of the plurality of integrated circuit dies.