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기록

IMAGE SENSOR WITH STACKED COLOR FILTERS OR MULTI-STATE TUNABLE COLOR FILTER

발명심사 중
23청구항 · 6 독립항
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개요

발명자

Ning Xu; Tao Chen; Serhad Doken; Jean-Yves Couleaud

IPC 분류

H4N 25/13H1L 27/146H4N 23/84

CPC 분류

H4N25/13H4N23/84H4N25/17H10F39/1825H10F39/8053

An image sensor with one or more imaging sensor layers and/or one or more color filter layers is provided. Imaging sensor layers sense different combinations of wavelengths of light depending in part on filtered light passing through the color filter layers. The color filter layers, which can be tunable filters, plasmonic color filters or dielectric subwavelength grating filters, allow certain colors of light to pass through to the imaging sensor layers and block others. The image sensor is connected to control circuitry that measures the properties of light received at each imaging sensor layer, reconstructs the color components of each pixel of the imaging sensor layers based on these measurements, and generates full-color image data from the color components. Methods of manufacturing the image sensor are also provided using lithography and securing the layers in a sensor stack using a bonding substrate.

원문 (중국어)

An image sensor with one or more imaging sensor layers and/or one or more color filter layers is provided. Imaging sensor layers sense different combinations of wavelengths of light depending in part on filtered light passing through the color filter layers. The color filter layers, which can be tunable filters, plasmonic color filters or dielectric subwavelength grating filters, allow certain colors of light to pass through to the imaging sensor layers and block others. The image sensor is connected to control circuitry that measures the properties of light received at each imaging sensor layer, reconstructs the color components of each pixel of the imaging sensor layers based on these measurements, and generates full-color image data from the color components. Methods of manufacturing the image sensor are also provided using lithography and securing the layers in a sensor stack using a bonding substrate.