PRINTED SUBSTRATE AND MOUNTED PRODUCT PRODUCTION METHOD
개요
발명자
Makoto BEKKE
IPC 분류
CPC 분류
A printed substrate used in the mounting of a heat-dissipation member includes a first pad; a second pad connected to a portion of the periphery of the first pad; and a solder paste coated on the second pad. The solder paste has a protruding part that protrudes from the second pad towards the first pad through the connected portion of the first pad and the second pad. The protruding part extends to the inside of a terminal arrangement region of the first pad.
원문 (중국어)
A printed substrate used in the mounting of a heat-dissipation member includes a first pad; a second pad connected to a portion of the periphery of the first pad; and a solder paste coated on the second pad. The solder paste has a protruding part that protrudes from the second pad towards the first pad through the connected portion of the first pad and the second pad. The protruding part extends to the inside of a terminal arrangement region of the first pad.