PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME
개요
출원인
SAMSUNG ELECTRO-MECHANICS CO., LTD.
발명자
Tae Hong MIN; Jong Eun PARK
IPC 분류
CPC 분류
The present disclosure relates to a printed circuit board including: a frame having a through-portion; a glass layer at least partially disposed within the through-portion; a first insulating material filling at least a portion of a space between the frame and the glass layer; a second insulating material disposed on upper sides of the frame and the glass layer; and a third insulating material disposed on lower sides of the frame and the glass layer, and the first insulating material includes a material different from the second and third insulating materials.
원문 (중국어)
The present disclosure relates to a printed circuit board including: a frame having a through-portion; a glass layer at least partially disposed within the through-portion; a first insulating material filling at least a portion of a space between the frame and the glass layer; a second insulating material disposed on upper sides of the frame and the glass layer; and a third insulating material disposed on lower sides of the frame and the glass layer, and the first insulating material includes a material different from the second and third insulating materials.