PRINTED CIRCUIT BOARD
개요
출원인
SAMSUNG ELECTRO-MECHANICS CO., LTD.
발명자
Chi Hyeon Jeong; Myoung Hoon Kim; Seok Hwan Kim; Bong Bu Jung
IPC 분류
CPC 분류
The present disclosure relates to a printed circuit board including: a substrate having a first through-portion; a metal pattern disposed on at least one surface of the substrate and extending onto a wall surface of the first through-portion; a first optical member disposed in the first through-portion; a dielectric layer disposed on the substrate, filling the first through-portion and covering each of the metal pattern and the first optical member, an optical waveguide pattern embedded in the dielectric layer and disposed on the substrate; and a mirror embedded in the dielectric layer and disposed on the first through-portion.
원문 (중국어)
The present disclosure relates to a printed circuit board including: a substrate having a first through-portion; a metal pattern disposed on at least one surface of the substrate and extending onto a wall surface of the first through-portion; a first optical member disposed in the first through-portion; a dielectric layer disposed on the substrate, filling the first through-portion and covering each of the metal pattern and the first optical member, an optical waveguide pattern embedded in the dielectric layer and disposed on the substrate; and a mirror embedded in the dielectric layer and disposed on the first through-portion.