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Mounting Body, Ultrasonic Sensor, And Multi-Feed Detection Device

발명심사 중
4조회수
8청구항 · 2 독립항
§ Ⅰ

개요

발명자

Masayoshi YAMADA; Hikaru IWAI; Eiji OSAWA; Kiichi TAKEDA

IPC 분류

H5K 1/18G1H 11/8H5K 1/2

CPC 분류

H5K1/18G1H11/8H5K1/298H5K2201/10151

The circuit substrateincludes the first wiring layerelectrically coupled to the circuit, the element substrateincludes a first substrate, a diaphragm, a piezoelectric element, the second substrate, and a second wiring layerelectrically coupled with the piezoelectric element, and it includes the third wiring layercoupled with the first wiring layerand second wiring layer, and the protectorthat covers the third wiring layer

원문 (중국어)

The circuit substrateincludes the first wiring layerelectrically coupled to the circuit, the element substrateincludes a first substrate, a diaphragm, a piezoelectric element, the second substrate, and a second wiring layerelectrically coupled with the piezoelectric element, and it includes the third wiring layercoupled with the first wiring layerand second wiring layer, and the protectorthat covers the third wiring layer