SEMICONDUCTOR MEMORY SYSTEM INCLUDING SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
개요
발명자
Ki Chang JEONG; Nam Kuk KIM
IPC 분류
CPC 분류
A semiconductor memory system includes a semiconductor memory device. The semiconductor memory device includes a first stack, a second stack, and a third stack. The second stack is disposed over the first stack. The second stack includes a plurality of word lines stacked and insulated from each other. The third stack is disposed over the second stack. The third stack includes a second selection line. The channel structure includes a first channel pillar formed through the first stack and the second stack, and a second channel pillar contacting the first channel pillar and formed in the third stack. A diameter of the second channel pillar is smaller than a diameter of the first channel pillar.
원문 (중국어)
A semiconductor memory system includes a semiconductor memory device. The semiconductor memory device includes a first stack, a second stack, and a third stack. The second stack is disposed over the first stack. The second stack includes a plurality of word lines stacked and insulated from each other. The third stack is disposed over the second stack. The third stack includes a second selection line. The channel structure includes a first channel pillar formed through the first stack and the second stack, and a second channel pillar contacting the first channel pillar and formed in the third stack. A diameter of the second channel pillar is smaller than a diameter of the first channel pillar.