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기록

Integrated Circuitry Comprising a Memory Array Comprising Strings of Memory Cells and Methods Used in Forming a Memory Array Comprising Strings of Memory Cells

발명심사 중
19청구항 · 3 독립항
§ Ⅰ

개요

발명자

Daniel Billingsley; Jordan D. Greenlee; John D. Hopkins; Yongjun Jeff Hu; Swapnil Lengade

IPC 분류

H10B 41/27G11C 16/4H10B 41/10H10B 41/35H10B 43/10H10B 43/27H10B 43/35

CPC 분류

H10B41/27G11C16/483H10B41/10H10B41/35H10B43/10H10B43/27H10B43/35

A method used in forming a memory array comprising strings of memory cells comprises forming an upper stack directly above a lower stack. The lower stack comprises vertically-alternating lower-first-tiers and lower-second-tiers. The upper stack comprises vertically-alternating upper-first-tiers and upper-second-tiers. Lower channel openings extend through the lower-first-tiers and the lower-second-tiers. The lower channel openings have sacrificial material therein. An upper of the lower-second-tiers or a lower of the upper-second-tiers comprises non-stoichiometric silicon dioxide that has a silicon-to-oxygen atomic ratio greater than 0.5. A higher of the upper-second-tiers that is above said lower upper-second-tier comprises silicon dioxide that has a silicon-to-oxygen atomic ratio less than or equal to 0.5. Upper channel openings are etched through the upper-first-tiers and the upper-second-tiers to stop on said upper lower-second-tier or said lower upper-second-tier. After the stop, the sacrificial material is removed from the lower channel openings and channel-material strings are formed in the upper and lower channel openings. Other embodiments, including structure independent of method, are disclosed.

원문 (중국어)

A method used in forming a memory array comprising strings of memory cells comprises forming an upper stack directly above a lower stack. The lower stack comprises vertically-alternating lower-first-tiers and lower-second-tiers. The upper stack comprises vertically-alternating upper-first-tiers and upper-second-tiers. Lower channel openings extend through the lower-first-tiers and the lower-second-tiers. The lower channel openings have sacrificial material therein. An upper of the lower-second-tiers or a lower of the upper-second-tiers comprises non-stoichiometric silicon dioxide that has a silicon-to-oxygen atomic ratio greater than 0.5. A higher of the upper-second-tiers that is above said lower upper-second-tier comprises silicon dioxide that has a silicon-to-oxygen atomic ratio less than or equal to 0.5. Upper channel openings are etched through the upper-first-tiers and the upper-second-tiers to stop on said upper lower-second-tier or said lower upper-second-tier. After the stop, the sacrificial material is removed from the lower channel openings and channel-material strings are formed in the upper and lower channel openings. Other embodiments, including structure independent of method, are disclosed.