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기록

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

발명심사 중
2조회수
10청구항 · 2 독립항
§ Ⅰ

개요

발명자

Boon Keat Toh; Chih-Hsin Chang; Szu Han Wu; Chi Ren

IPC 분류

H10D 30/68H10B 41/35H10D 30/1H10D 62/83H10D 64/62

CPC 분류

H10D30/68H10B41/35H10D30/22H10D30/411H10D62/83H10D64/62

Provided are a semiconductor device and a manufacturing method thereof. The semiconductor device includes a substrate having a first memory region. The first memory region includes a first dielectric layer, a first floating gate, a first inter-gate dielectric layer, a control gate and a first contact. The first dielectric layer is disposed on the substrate. The first floating gate is disposed on the first dielectric layer. The first inter-gate dielectric layer is disposed on the first floating layer. The control gate is disposed on the first inter-gate dielectric layer. The first contact penetrates through the first control gate and the first inter-gate dielectric layer and is landed on the first floating gate.

원문 (중국어)

Provided are a semiconductor device and a manufacturing method thereof. The semiconductor device includes a substrate having a first memory region. The first memory region includes a first dielectric layer, a first floating gate, a first inter-gate dielectric layer, a control gate and a first contact. The first dielectric layer is disposed on the substrate. The first floating gate is disposed on the first dielectric layer. The first inter-gate dielectric layer is disposed on the first floating layer. The control gate is disposed on the first inter-gate dielectric layer. The first contact penetrates through the first control gate and the first inter-gate dielectric layer and is landed on the first floating gate.