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기록

HETEROEPITAXIAL WAFER FOR THE DEPOSITION OF GALLIUM NITRIDE

발명심사 중
5조회수
12청구항 · 1 독립항
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개요

발명자

Brian MURPHY; Sarad Bahadur THAPA

IPC 분류

H10D 62/85H1L 21/2

CPC 분류

H10D62/8503H1L21/2381H1L21/2458H1L21/254

A heteroepitaxial wafer includes, in the following order: (1) a substrate made of silicon having a thickness, a diameter, a crystal orientation, a resistivity, a frontside, and a backside; (2) a nucleation layer comprising aluminium nitride (AlN) and 3C-SiC; (3) a first boron nitride layer having a first boron nitride layer thickness; and (4) a layer of nitride having a nitride layer thickness comprising an element out of the list of elements of aluminum, gallium, indium and thallium.

원문 (중국어)

A heteroepitaxial wafer includes, in the following order: (1) a substrate made of silicon having a thickness, a diameter, a crystal orientation, a resistivity, a frontside, and a backside; (2) a nucleation layer comprising aluminium nitride (AlN) and 3C-SiC; (3) a first boron nitride layer having a first boron nitride layer thickness; and (4) a layer of nitride having a nitride layer thickness comprising an element out of the list of elements of aluminum, gallium, indium and thallium.