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기록

DISPLAY APPARATUS

발명심사 중
1조회수
20청구항 · 2 독립항
§ Ⅰ

개요

발명자

TaeYoon KIM; HyeSun JUNG; BungGoo KIM; HyoungHo AHN; HeeWon LEE; JunYoung JO

IPC 분류

H10H 29/41H1L 25/16H10H 29/37H10H 29/49

CPC 분류

H10H29/41H1L25/167H10H29/37H10H29/49

According to an aspect of the present disclosure, a display apparatus includes a substrate having a plurality of pixel driving circuits thereon. An over coating layer encloses the plurality of pixel driving circuits on the substrate, and a 1-1-th connection line is disposed on the over coating layer and electrically connected to the plurality of pixel driving circuits. A plurality of organic insulating layers is disposed on the pixel driving circuits, the over coating layer, and the 1-1-th connection line. A plurality of banks is disposed on the plurality of organic insulating layers, and a plurality of micro LEDs is disposed on the plurality of banks and electrically connected to the pixel driving circuits. The 1-1-th connection line is positioned such that its height is lower than the top surface of the pixel driving circuit. This structure helps to improve surface planarity and facilitates reliable micro LED transfer and electrical connection.

원문 (중국어)

According to an aspect of the present disclosure, a display apparatus includes a substrate having a plurality of pixel driving circuits thereon. An over coating layer encloses the plurality of pixel driving circuits on the substrate, and a 1-1-th connection line is disposed on the over coating layer and electrically connected to the plurality of pixel driving circuits. A plurality of organic insulating layers is disposed on the pixel driving circuits, the over coating layer, and the 1-1-th connection line. A plurality of banks is disposed on the plurality of organic insulating layers, and a plurality of micro LEDs is disposed on the plurality of banks and electrically connected to the pixel driving circuits. The 1-1-th connection line is positioned such that its height is lower than the top surface of the pixel driving circuit. This structure helps to improve surface planarity and facilitates reliable micro LED transfer and electrical connection.