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기록

Power module assembly, motor controller and vehicle

기타 / 미제공알 수 없음

데이터 출처: EPO OPS

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88996629패밀리
§ Ⅰ

개요

출원인

BYD CO LTD

출원 번호

CN202210611298

발명자

LIAN YUBO; LING HEPING; ZHAI ZHEN; LIU HAIJUN; ZHANG HAIXING

출원일

May 31, 2022

공개일

Aug 7, 2026

특허 패밀리 ID

88996629

IPC 분류

H01L25/07H10W40/22H10W40/73H10W70/40

The invention discloses a power module assembly, a motor controller and a vehicle, and the power module assembly comprises a chip layer which comprises a substrate and a chip disposed on the substrate; a first heat dissipation part and a second heat dissipation part, wherein the chip layer is arranged between the first heat dissipation part and the second heat dissipation part; wherein one side, deviating from the chip layer, of the first heat dissipation part is suitable for exchanging heat with an external heat dissipation medium to reduce the temperature of the chip layer, and the second heat dissipation part is internally provided with a phase change medium and absorbs heat of the chip layer through phase change. According to the power module assembly designed by the invention, a one-side water cooling mode and a one-side change material heat absorption mode are adopted for heat dissipation of the chip, cooling is rapid, and the cooling effect is obvious.

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