Power module assembly, motor controller and vehicle
데이터 출처: EPO OPS
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개요
출원 번호
CN202210611298
발명자
LIAN YUBO; LING HEPING; ZHAI ZHEN; LIU HAIJUN; ZHANG HAIXING
출원일
May 31, 2022
공개일
Aug 7, 2026
특허 패밀리 ID
88996629
IPC 분류
The invention discloses a power module assembly, a motor controller and a vehicle, and the power module assembly comprises a chip layer which comprises a substrate and a chip disposed on the substrate; a first heat dissipation part and a second heat dissipation part, wherein the chip layer is arranged between the first heat dissipation part and the second heat dissipation part; wherein one side, deviating from the chip layer, of the first heat dissipation part is suitable for exchanging heat with an external heat dissipation medium to reduce the temperature of the chip layer, and the second heat dissipation part is internally provided with a phase change medium and absorbs heat of the chip layer through phase change. According to the power module assembly designed by the invention, a one-side water cooling mode and a one-side change material heat absorption mode are adopted for heat dissipation of the chip, cooling is rapid, and the cooling effect is obvious.
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