Chip on film and display module
데이터 출처: EPO OPS
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개요
출원 번호
CN202410444499
발명자
SUN XIAOYE; ZHENG LIMING; BAO YUFENG; ZHANG YIFAN; HE HENGSUO; MA CHUAN
출원일
Apr 12, 2024
공개일
Jul 16, 2024
특허 패밀리 ID
91815325
IPC 분류
CPC 분류
The invention provides a chip on film and a display module. The chip on film comprises a stacked substrate and a conductive layer, the insulating layer is arranged on the side, away from the substrate, of the conductive layer, and the orthographic projection of the insulating layer on the substrate covers the orthographic projection of the conductive layer on the substrate; the first electrostatic wire is arranged on the substrate and on the periphery of the conducting layer, the orthographic projection of the first electrostatic wire on the substrate does not coincide with the orthographic projection of the insulating layer on the substrate, and the first electrostatic wire is used for attracting and guiding out electrostatic charges on the periphery of the conducting layer; according to the invention, the first electrostatic wire is arranged at the periphery of the conductive layer, so that the electrostatic charges can be led out, the accumulation of the electrostatic charges in the edge area of the chip on film is avoided, the problems of short circuit or damage and the like caused by the migration of the electrostatic charges to the conductive layer or a driving element are prevented, and the product quality of the chip on film is improved.
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