Packing material and preparation method thereof

The invention provides a packaging material and a preparation method thereof, relates to the technical field of packaging, and aims to improve the anti-static capability of the packaging material. The packaging material comprises a substrate, a first conductive layer, a second conductive layer and a conductive sticker, wherein the substrate comprises a first surface and a second surface which are opposite to each other, and a side surface connected with the first surface and the second surface. The first conductive layer is disposed on the first surface, and a portion of the first conductive layer is embedded in the substrate. The second conductive layer is disposed on the second surface, and a portion of the second conductive layer is embedded in the substrate. The conductive paster is arranged on the first surface, the side surface and the second surface and is connected with the first conductive layer and the second conductive layer. The packaging material can be used for packaging electronic equipment.