Backlight module, preparation method thereof and display device
데이터 출처: EPO OPS
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개요
출원 번호
CN202310182016
발명자
LV ZHIJUN; ZHOU JINGSHANG; LIU WENQU; MENG DETIAN; CUI ZHAO; DONG LIWEN; ZHANG FENG; YAO QI; HOU DONGFEI; LI YUQIAO; DONG SHIHAO; ZHANG JIAXIANG
출원일
Feb 21, 2023
공개일
Aug 23, 2024
특허 패밀리 ID
92381528
IPC 분류
CPC 분류
The invention relates to the technical field of display, and discloses a backlight module, a preparation method thereof and a display device. The backlight module is provided with a light-emitting area and a first non-light-emitting area, the first non-light-emitting area comprises a first binding area, a first bending area and a second binding area which are connected in sequence, and the first binding area is closer to the light-emitting area relative to the second binding area; the backlight module comprises a substrate, a first conductive layer, an insulating layer group and a second conductive layer which are sequentially stacked, the first conductive layer comprises a first binding pin and a connecting wire, and the first binding pin is connected with the first part connecting wire; the second conductive layer comprises a second binding pin, and the second binding pin is connected with the second part connecting wire; the first binding pin is located in the second binding area, and the second binding pin is located in the first binding area; or, the first binding pin is located in the first binding area, and the second binding pin is located in the second binding area. The partition density of the light-emitting area of the backlight module is high.
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