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기록

Camera module and electronic equipment

기타 / 미제공알 수 없음

데이터 출처: EPO OPS

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92717843패밀리
§ Ⅰ

개요

출원인

HUAWEI TECH CO LTD

출원 번호

CN202310268408

발명자

FAN XIANKAI; GUAN TIANKUI; JIANG HAIXIA; XIAO ZHUOJIE; LI LE

출원일

Mar 14, 2023

공개일

Sep 20, 2024

특허 패밀리 ID

92717843

IPC 분류

G03B11/00G03B30/00H04M1/02H04N23/50H04N23/54H04N23/55H04N23/57H10W74/00

CPC 분류

G02B7/006G02B7/025G03B11/00G03B30/00H04M1/02H04M1/0264H04N23/50H04N23/54H04N23/55H04N23/57G03B2217/002H04M2250/52

The invention provides a camera module and electronic equipment. The camera module comprises a circuit assembly, a motor, a lens, an image sensor, an adhesive and an optical filter. The motor is fixed to the circuit assembly. The lens is mounted on the motor. The image sensor is fixed and electrically connected to the circuit assembly. The first surface of the image sensor faces the lens. The first face includes an imaging region and an edge region surrounding the imaging region. The adhesive is fixed to the circuit assembly and surrounds the image sensor. Or the bonding glue is fixed on the edge area of the first surface. The optical filter is fixed to the surface, away from the circuit assembly, of the adhesive. The viscosity of the adhesive is greater than 10000 Cps, the thixotropic index is greater than 2, the Young modulus at room temperature is in a range of 1000 MPa to 10000 MPa, and the thermal expansion coefficient is less than 80 ppm/k. According to the camera module, the adhesive is arranged to replace a fixed step to support the optical filter, so that the camera module which is relatively high in photographing performance and relatively thin in thickness is obtained.

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