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Storage array, electronic equipment, memory and manufacturing method of storage array

기타 / 미제공알 수 없음

데이터 출처: EPO OPS

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92723427패밀리
§ Ⅰ

개요

출원인

HUAWEI TECH CO LTD

출원 번호

CN202310284767

발명자

LYU HANGBING; WANG CHAO; XU YANNAN; XU JUNHAO

출원일

Mar 15, 2023

공개일

Sep 20, 2024

특허 패밀리 ID

92723427

IPC 분류

H10B12/00H10B53/30

CPC 분류

H10B12/30H10B53/30

The embodiment of the invention provides a storage array, electronic equipment, a memory and a manufacturing method of the storage array, which are used for solving the technical problem of low storage density of the memory. The memory array includes a substrate and transistors. The transistor includes a first channel layer, a first insulating layer, a first conductive layer, a first polarization layer, and a first gate. The first channel layer and the first conductive layer are respectively arranged on two opposite sides of the first insulating layer along the direction parallel to the substrate; the first polarization layer is arranged on one side, deviating from the first insulating layer, of the first conductive layer; the first grid is arranged on the side, away from the first conductive layer, of the first polarization layer. The first source line and the first bit line are arranged on the side, away from the first insulating layer, of the first channel layer. According to the storage array provided by the embodiment of the invention, the film layers are horizontally stacked, the storage density is high, a larger device operation window is provided, multi-valued storage can be realized, crosstalk is solved, and the adopted AND gate (AND) architecture process is high in compatibility and low in difficulty.

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