Shell and component common ground structure and electronic equipment
데이터 출처: EPO OPS
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개요
출원 번호
CN202421595319U
발명자
DENG MINGYANG; KANG ZILING; LIN ZHEN; LIANG ZHIJUN; JI CUIPING
출원일
Jul 8, 2024
공개일
Sep 24, 2024
특허 패밀리 ID
92784396
IPC 분류
The embodiment of the utility model discloses a common ground structure of a shell and a component and electronic equipment. The common ground structure of the shell and the components comprises the shell with conductive performance, a multi-layer circuit board, the components arranged on the multi-layer circuit board and a fastener with conductive performance, the multilayer circuit board is provided with a circuit board through hole, the fastener is locked into the circuit board through hole, and the fastener locked into the circuit board through hole is in contact with the shell; the inner wall of the circuit board through hole is provided with a plurality of conductive contacts used for making contact with the fastener, different conductive contacts are connected with different target inner electric layers of the multilayer circuit board, and the target inner electric layers are inner electric layers, connected with the component, in the multilayer circuit board. According to the common-ground structure of the shell and the component provided by the embodiment of the invention, the risk of an insulation fault of the component can be reduced.
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