ELECTRODE MANUFACTURING APPARATUS
Dossier Overview
Applicant
SAMSUNG SDI CO., LTD.
Inventor
Kyuchul CHOI
IPC Classification
CPC Classification
An embodiment provides an electrode manufacturing apparatus including a first roller configured to move an electrode plate that includes a coated portion and a non-coated portion in a first direction and a second roller that is spaced from the first roller and is configured to move the electrode plate in the first direction. A jig unit that is disposed between the first roller and the second roller and is configured to press and fix the electrode plate in a third direction intersecting the first direction. A laser cutting portion is provided adjacent to the jig unit and is configured to cut at least one of the coated and uncoated portions of the electrode plate fixed to the jig unit into a set shape using a laser beam. A controller is connected to the jig unit and the laser cutting portion and is configured to control the jig unit and the laser cutting portion.
Original (Chinese)
An embodiment provides an electrode manufacturing apparatus including a first roller configured to move an electrode plate that includes a coated portion and a non-coated portion in a first direction and a second roller that is spaced from the first roller and is configured to move the electrode plate in the first direction. A jig unit that is disposed between the first roller and the second roller and is configured to press and fix the electrode plate in a third direction intersecting the first direction. A laser cutting portion is provided adjacent to the jig unit and is configured to cut at least one of the coated and uncoated portions of the electrode plate fixed to the jig unit into a set shape using a laser beam. A controller is connected to the jig unit and the laser cutting portion and is configured to control the jig unit and the laser cutting portion.
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