RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND WIRING BOARD
개요
출원인
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
발명자
Hajime OGUSHI; Hayate HIRONO; Takatoshi MITO; Koichi ISAJI; Hiroyuki FUJISAWA
IPC 분류
CPC 분류
A resin composition contains a polyphenylene ether compound (A), a reactive compound (B) having an unsaturated double bond in a molecule, and at least one additive (C) selected from the group consisting of a heavy metal deactivator (C1) having at least one of an amino group and a triazole structure and a phenolic hydroxyl group in a molecule, a phosphite-based antioxidant (C2) having a tertiary butyl group and a phosphite structure in a molecule, and a hindered phenol-based antioxidant (C3) having a tertiary butyl group and a phenolic hydroxyl group in a molecule.
원문 (중국어)
A resin composition contains a polyphenylene ether compound (A), a reactive compound (B) having an unsaturated double bond in a molecule, and at least one additive (C) selected from the group consisting of a heavy metal deactivator (C1) having at least one of an amino group and a triazole structure and a phenolic hydroxyl group in a molecule, a phosphite-based antioxidant (C2) having a tertiary butyl group and a phosphite structure in a molecule, and a hindered phenol-based antioxidant (C3) having a tertiary butyl group and a phenolic hydroxyl group in a molecule.