JIG MODULE AND CIRCUIT BOARD TESTING METHOD USING THE SAME
개요
발명자
Yong-Jyun Lu; CHE-MING WANG
IPC 분류
CPC 분류
A jig module and circuit board testing method using thereof are provided. The jig module includes a guiding jig. The guiding jig is disposed inside a mechanism element along a travel direction, and a circuit board is disposed inside the mechanism element. The guiding jig includes a platform, a first alignment structure, and a second alignment structure. The platform has a top and a bottom, and the platform includes a plurality of through holes penetrating the top surface and the bottom surface. When the guiding jig is disposed inside the mechanism element, the first alignment structure aligns with the mechanical component along a first direction and a second direction, and the second alignment structure aligns with the circuit board along a third direction, such that the plurality of through holes can be aligned with a plurality of test points on the circuit board.
원문 (중국어)
A jig module and circuit board testing method using thereof are provided. The jig module includes a guiding jig. The guiding jig is disposed inside a mechanism element along a travel direction, and a circuit board is disposed inside the mechanism element. The guiding jig includes a platform, a first alignment structure, and a second alignment structure. The platform has a top and a bottom, and the platform includes a plurality of through holes penetrating the top surface and the bottom surface. When the guiding jig is disposed inside the mechanism element, the first alignment structure aligns with the mechanical component along a first direction and a second direction, and the second alignment structure aligns with the circuit board along a third direction, such that the plurality of through holes can be aligned with a plurality of test points on the circuit board.