ELECTRONIC PACKAGE

원문 (중국어)

An electronic package includes a carrier structure, an optoelectronic module, at least a first transceiver module, a first semiconductor component, and a heat dissipation component. The optoelectronic module is disposed on and electrically connected to the carrier structure, and includes an optoelectronic component and a first encapsulating layer covering the optoelectronic component. The first transceiver module includes a first optical signal transmission unit. The first semiconductor component is disposed on and electrically connected to the carrier structure. The heat dissipation component is connected to the first semiconductor component, and the first transceiver module is coupled to the heat dissipation component. Hence, the number of optical fibers connected to the electronic package can be increased, so the amount of data that can be received and transmitted by the electronic package per unit time can be greatly increased, thereby significantly improving data transmission and processing speed of the electronic package.