PHOTONIC ENGINE WITH FACETS AND THE METHODS OF FORMING THE SAME

원문 (중국어)

A method includes forming a reconstructed wafer, which includes a supporting substrate, an electronic die over the supporting substrate, and a photonic die over the electronic die. The method further includes a first etching process to form a first trench in the reconstructed wafer, and a second etching process to form a second trench. The photonic die has a first sidewall facing the first trench. The second trench extends from a bottom of the first trench to the supporting substrate, and the second etching process results in a second sidewall facing the second trench. The method further includes forming a protection layer on the first sidewall and the second sidewall, and sawing the supporting substrate to form a photonic package comprising the photonic die, the electronic die, and a portion of the supporting substrate