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案件記録

NANOIMPRINT LITHOGRAPHY MASK AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

発明審査中
1閲覧数
20請求項 · 3 独立
§ Ⅰ

案件概要

発明者

Yu-Luen DENG; Chih-Kai YANG; Chien-Cheng CHEN; Hsuan-Chin LU; Meng-Jung LEE; Ming-Feng SHIEH

IPC分類

G3F 7/G3F 7/20

CPC分類

G3F7/2G3F7/2018

A method of manufacturing a semiconductor device includes forming a resist layer over a substrate and contacting the resist layer with a mask. The mask includes: a device region including a device pattern at a first level, an overlapping region surrounding the device region and having a light absorption material at a second level, and a peripheral region surrounding the device region and the overlapping region, and including a light blocking material at a third level, wherein the first, second, and third levels are at different positions. The resist layer is exposed to actinic radiation through the mask. The mask is removed from the resist layer, and portions of the resist layer not exposed to the actinic radiation are removed.

原文(中国語)

A method of manufacturing a semiconductor device includes forming a resist layer over a substrate and contacting the resist layer with a mask. The mask includes: a device region including a device pattern at a first level, an overlapping region surrounding the device region and having a light absorption material at a second level, and a peripheral region surrounding the device region and the overlapping region, and including a light blocking material at a third level, wherein the first, second, and third levels are at different positions. The resist layer is exposed to actinic radiation through the mask. The mask is removed from the resist layer, and portions of the resist layer not exposed to the actinic radiation are removed.

外部リソース