PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER, AND SEMICONDUCTOR DEVICE USING THE SAME
案件概要
発明者
Sang Soo KIM; Taek-Jin BAEK; Heekyoung KANG; Jinhee KANG; Jiyu KIM; Mingyum KIM; Chungbeum HONG; Byeongwook PARK; Yushin PARK
IPC分類
CPC分類
A photosensitive resin composition, a photosensitive resin layer manufactured using the photosensitive resin composition, and a semiconductor device including the photosensitive resin layer are provided. The photosensitive resin composition includes (A) a resin, (B) a photopolymerizable compound, (C) a photopolymerization initiator, and (D) a solvent. The photopolymerizable compound includes a compound represented by Chemical Formula 1.
原文（中国語）
A photosensitive resin composition, a photosensitive resin layer manufactured using the photosensitive resin composition, and a semiconductor device including the photosensitive resin layer are provided. The photosensitive resin composition includes (A) a resin, (B) a photopolymerizable compound, (C) a photopolymerization initiator, and (D) a solvent. The photopolymerizable compound includes a compound represented by Chemical Formula 1.
外部リソース