MEMORY DEVICE
Dossier Overview
Applicant
Kioxia Corporation
Inventor
Kosuke KASUGA
IPC Classification
CPC Classification
A memory device includes a substrate; a first circuit layer provided between the substrate and a bonding surface and including a first circuit; a second circuit layer provided above the bonding surface and including a second circuit; and a wiring layer provided above the second circuit layer and including a plurality of first wirings and a plurality of second wirings, each of the first and second wirings extending in a first direction. The plurality of first wirings are electrically connected to at least one of the first circuit or the second circuit. The plurality of second wirings are electrically connected to each other. The first wirings and the second wirings are arranged alternately in a second direction along a substrate surface of the substrate, the second direction intersecting the first direction.
Original (Chinese)
A memory device includes a substrate; a first circuit layer provided between the substrate and a bonding surface and including a first circuit; a second circuit layer provided above the bonding surface and including a second circuit; and a wiring layer provided above the second circuit layer and including a plurality of first wirings and a plurality of second wirings, each of the first and second wirings extending in a first direction. The plurality of first wirings are electrically connected to at least one of the first circuit or the second circuit. The plurality of second wirings are electrically connected to each other. The first wirings and the second wirings are arranged alternately in a second direction along a substrate surface of the substrate, the second direction intersecting the first direction.
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