DISTRIBUTED TEMPERATURE SENSORS IN A DIE OF A MEMORY DEVICE
卷宗概要
申请人
Micron Technology, Inc.
发明人
Elena Cabrera Bernal; Fabien Funfrock; Jens Polney; Suhas Shivapakash
IPC 分类
CPC 分类
Methods, systems, and devices for distributed temperature sensors in a die of a memory device are described. For example, the distributed temperature sensors may enable a memory system controller to detect hotspots or uneven temperature distributions across the memory system. The memory system controller may perform health monitoring reporting based on the detected hotspots or uneven temperature distributions. In some examples, the memory system controller may activate, or deactivate, one or more components of regions associated with the hotspots to reduce the temperature of the region or die. Additionally, or alternatively, the memory system controller may adjust or retrain a clock signal to compensate for the detected hotspots or uneven temperature distributions.
原文（中文）
Methods, systems, and devices for distributed temperature sensors in a die of a memory device are described. For example, the distributed temperature sensors may enable a memory system controller to detect hotspots or uneven temperature distributions across the memory system. The memory system controller may perform health monitoring reporting based on the detected hotspots or uneven temperature distributions. In some examples, the memory system controller may activate, or deactivate, one or more components of regions associated with the hotspots to reduce the temperature of the region or die. Additionally, or alternatively, the memory system controller may adjust or retrain a clock signal to compensate for the detected hotspots or uneven temperature distributions.