MANUFACTURING APPARATUS FOR ENAMELED COPPER WIRE AND MANUFACTURING METHOD FOR ENAMELED COPPER WIRE
案件概要
発明者
Akira SETOGAWA; Hajime NISHI; Takami USHIWATA; Yuki HONDA; Takumi SATO; Sohei KODAMA
IPC分類
CPC分類
A manufacturing apparatus for an enameled copper wire of the present disclosure includes: a coating material application section configured to apply a coating material to a surface of a conductor in traveling; a baking section configured to bake the conductor to which the coating material has been applied; and a dehumidifying section configured to set an absolute humidity in a space in which the manufacturing apparatus is installed to 18 g/mor less.
原文（中国語）
A manufacturing apparatus for an enameled copper wire of the present disclosure includes: a coating material application section configured to apply a coating material to a surface of a conductor in traveling; a baking section configured to bake the conductor to which the coating material has been applied; and a dehumidifying section configured to set an absolute humidity in a space in which the manufacturing apparatus is installed to 18 g/mor less.
外部リソース