REFLECTOR ASSEMBLIES FOR SUBSTRATE PROCESSING ADJUSTABILITY, AND RELATED PROCESS CHAMBERS, METHODS, AND SYSTEMS
Dossier Overview
Applicant
Applied Materials, Inc.
Inventor
Michael R. RICE; Kim Ramkumar VELLORE; Shu-Kwan LAU; Kalaivanan MOHANADASS; Sushant Suresh KOSHTI; Martin Jeffrey SALINAS; Paul BRILLHART
IPC Classification
CPC Classification
The present disclosure relates to reflector assemblies for substrate processing adjustability in semiconductor manufacturing, and related process chambers, methods, and systems. In one or more embodiments, a process chamber includes a chamber body at least partially defining a processing volume, a substrate support disposed in the processing volume, and a heat assembly disposed outwardly of the processing volume. The heat assembly is operable to direct radiation to a target location in the processing volume. The heat assembly includes a reflector pivotable relative to an axis to move the target location and scan the radiation, and a radiation source oriented to emit radiation toward the reflector.
Original (Chinese)
The present disclosure relates to reflector assemblies for substrate processing adjustability in semiconductor manufacturing, and related process chambers, methods, and systems. In one or more embodiments, a process chamber includes a chamber body at least partially defining a processing volume, a substrate support disposed in the processing volume, and a heat assembly disposed outwardly of the processing volume. The heat assembly is operable to direct radiation to a target location in the processing volume. The heat assembly includes a reflector pivotable relative to an axis to move the target location and scan the radiation, and a radiation source oriented to emit radiation toward the reflector.
External Resources