SUBSTRATE ALIGNMENT APPARATUS, SUBSTRATE BONDING APPARATUS INCLUDING THE SAME, AND SUBSTRATE BONDING METHOD USING THE SUBSTRATE BONDING APPARATUS
卷宗概要
发明人
Jae Ho HONG; Tae Hong MIN; Sang Jun PARK; Tae-Hoi PARK; Sang-Ho YUN
IPC 分类
CPC 分类
A substrate alignment apparatus is provided which includes a first support including first and second side surfaces opposite each other, wherein a first substrate on which a first alignment mark has been formed is placed on the first support; a second support disposed on the first support and including third and fourth side surfaces opposite each other, wherein a second substrate on which a second alignment mark has been formed is placed on the second support; a first recognition module disposed on the first side surface and configured to recognize the second alignment mark using diffracted light reflected from the second alignment mark; and a second recognition module disposed on the fourth side surface positioned above the second side surface and configured to recognize the first alignment mark using diffracted light reflected from the first alignment mark.
原文（中文）
A substrate alignment apparatus is provided which includes a first support including first and second side surfaces opposite each other, wherein a first substrate on which a first alignment mark has been formed is placed on the first support; a second support disposed on the first support and including third and fourth side surfaces opposite each other, wherein a second substrate on which a second alignment mark has been formed is placed on the second support; a first recognition module disposed on the first side surface and configured to recognize the second alignment mark using diffracted light reflected from the second alignment mark; and a second recognition module disposed on the fourth side surface positioned above the second side surface and configured to recognize the first alignment mark using diffracted light reflected from the first alignment mark.