SEMICONDUCTOR MANUFACTURING METHOD USING WARPAGE DEFORMATION
案件概要
発明者
Jinyoung LEE; Sunghyup KIM
IPC分類
CPC分類
A semiconductor manufacturing method using warpage deformation includes thermally deforming a three-dimensional warpage of a wafer into a two-dimensional warpage of the wafer by adjusting a temperature of each area of a plurality of areas of a stage where the wafer is mounted, chucking the wafer when the three-dimensional warpage of the wafer has been deformed into the two-dimensional warpage of the wafer, and performing a semiconductor process while the wafer is chucked.
原文（中国語）
A semiconductor manufacturing method using warpage deformation includes thermally deforming a three-dimensional warpage of a wafer into a two-dimensional warpage of the wafer by adjusting a temperature of each area of a plurality of areas of a stage where the wafer is mounted, chucking the wafer when the three-dimensional warpage of the wafer has been deformed into the two-dimensional warpage of the wafer, and performing a semiconductor process while the wafer is chucked.
外部リソース