HEAT SPREADERS THAT INCLUDE THERMAL DISSIPATION REGIONS COMPRISING DIAMOND
개요
발명자
Je-Young CHANG; Aastha UPPAL; Aravindha ANTONISWAMY
IPC 분류
CPC 분류
Assemblies comprising semiconductor devices, packages, and heat spreaders are provided. The heat spreaders comprise heat dissipation regions comprising diamond. The diamond can be, for example, a solid diamond plate or a composite comprising diamond particles. Methods for manufacturing assemblies comprising heat spreaders that include heat dissipation regions comprising diamond are also provided.
원문 (중국어)
Assemblies comprising semiconductor devices, packages, and heat spreaders are provided. The heat spreaders comprise heat dissipation regions comprising diamond. The diamond can be, for example, a solid diamond plate or a composite comprising diamond particles. Methods for manufacturing assemblies comprising heat spreaders that include heat dissipation regions comprising diamond are also provided.