SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
卷宗概要
发明人
Shinya NAKAGAWA; Toru KIYOHARA
IPC 分类
CPC 分类
A semiconductor device includes: a heatsink, an insulating sheet, a frame disposed on the insulating sheet, semiconductor elements mounted on the frame; and the sealing material sealing the heatsink, the insulating sheet, the frame, and the semiconductor elements while a surface of the heatsink on a side opposite to a surface to which the insulating sheet is attached and a part of the frame are exposed. An extension part extending to an outer peripheral side is provided to a part of a side part of the heatsink on a side of a surface to which the insulating sheet is attached, and provided to the side part of the heatsink is a level difference including at least two stages of a first level difference concaved from the extension part to an inner peripheral side and a second level difference concaved further to an inner peripheral side.
原文（中文）
A semiconductor device includes: a heatsink, an insulating sheet, a frame disposed on the insulating sheet, semiconductor elements mounted on the frame; and the sealing material sealing the heatsink, the insulating sheet, the frame, and the semiconductor elements while a surface of the heatsink on a side opposite to a surface to which the insulating sheet is attached and a part of the frame are exposed. An extension part extending to an outer peripheral side is provided to a part of a side part of the heatsink on a side of a surface to which the insulating sheet is attached, and provided to the side part of the heatsink is a level difference including at least two stages of a first level difference concaved from the extension part to an inner peripheral side and a second level difference concaved further to an inner peripheral side.