SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
개요
출원인
Amkor Technology Singapore Holding Pte. Ltd.
발명자
Keun Soo Kim; Jae Yun Kim; Byoung Jun Ahn; Dong Soo Ryu; Dae Byoung Kang; Chel Woo Park
IPC 분류
CPC 분류
A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.
원문 (중국어)
A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.