INTEGRATED DIE CIRCUIT
卷宗概要
申请人
Cirrus Logic International Semiconductor Ltd.
发明人
Lee R. COLEMAN; Omid AMIRI; Rupesh KHARE
IPC 分类
CPC 分类
An integrated circuit (IC) die configured for packaging in a plurality of different IC packages, the IC die comprising: a first set of die contacts positioned in a first region of the integrated circuit die; a second set of die contacts positioned in a second region of the integrated circuit die; a package type contact; and routing circuitry configured to selectively route signals to or from either the first set of die contacts or the second set of die contacts based on a package type signal received at the package type contact.
原文（中文）
An integrated circuit (IC) die configured for packaging in a plurality of different IC packages, the IC die comprising: a first set of die contacts positioned in a first region of the integrated circuit die; a second set of die contacts positioned in a second region of the integrated circuit die; a package type contact; and routing circuitry configured to selectively route signals to or from either the first set of die contacts or the second set of die contacts based on a package type signal received at the package type contact.