STRUCTURES WITH ENHANCED THERMAL HEAT SPREADING AND REMOVAL
개요
출원인
International Business Machines Corporation
발명자
John Knickerbocker; John W Golz; Keiji Matsumoto; Mukta Ghate Farooq
IPC 분류
CPC 분류
Structures including semiconductor chips (including chiplets and stacked chips/chiplets) are provided in which thermal heat removal is enhanced. The enhanced thermal heat removal is provided by utilizing interlayer dielectric (ILD) materials in at least one of the frontside back-end-of-the-line (BEOL) structure or the backside BEOL structure that have a high thermal conductivity.
원문 (중국어)
Structures including semiconductor chips (including chiplets and stacked chips/chiplets) are provided in which thermal heat removal is enhanced. The enhanced thermal heat removal is provided by utilizing interlayer dielectric (ILD) materials in at least one of the frontside back-end-of-the-line (BEOL) structure or the backside BEOL structure that have a high thermal conductivity.