SEMICONDUCTOR DEVICE
개요
발명자
Yusuke AKADA
IPC 분류
CPC 분류
A semiconductor device includes: a wiring substrate including a first bonding pad and a second bonding pad aligned with the first bonding pad in a first direction; a semiconductor element provided on the wiring substrate; and a connection wiring connecting the first bonding pad to the semiconductor element and including a first bonding wire and a second bonding wire arranged in the first direction. The first bonding pad includes a region not connected to the connection wiring, the region being partitioned by a protrusion provided on a surface of the first bonding pad, and being partitioned in a non-perpendicular direction with respect to the first direction or physically partially partitioned.
원문 (중국어)
A semiconductor device includes: a wiring substrate including a first bonding pad and a second bonding pad aligned with the first bonding pad in a first direction; a semiconductor element provided on the wiring substrate; and a connection wiring connecting the first bonding pad to the semiconductor element and including a first bonding wire and a second bonding wire arranged in the first direction. The first bonding pad includes a region not connected to the connection wiring, the region being partitioned by a protrusion provided on a surface of the first bonding pad, and being partitioned in a non-perpendicular direction with respect to the first direction or physically partially partitioned.