HEADPHONES

原文（中文）

The present disclosure discloses a headphone, and the headphone comprises a speaker assembly and a wearing assembly. The speaker assembly includes a bone conduction speaker. The bone conduction speaker includes a core housing, a first vibration transmitting plate, a transducer, a vibration plate, and a lead wire. The first vibration transmitting plate includes an inner ring fixing portion, an outer ring fixing portion, and at least two elastic connecting portions. The at least two elastic connecting portions are connected between the inner ring fixing portion and the outer ring fixing portion, the inner ring fixing portion is connected to the transducer, the outer ring fixing portion is connected to the core housing, so that the transducer is suspended in the core housing, and the vibration plate is connected to the transducer. The lead wire is connected to the transducer and includes a first lead portion extending from the inner ring fixing portion to the outer ring fixing portion. A dimension of the first vibration transmitting plate along a long axis direction is larger than a dimension of the first vibration transmitting plate along a short axis direction, and an angle between the first lead portion and the long axis direction is less than an angle between the first lead portion and the short axis direction. In this way, the structural stability of the speaker assembly can be enhanced.