ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

原文（中国語）

An electronic package is provided. A plurality of conductive posts with multilayer composite materials and at least one electronic component are disposed on a carrier structure. An encapsulation layer covers the at least one electronic component and the plurality of conductive posts. A circuit structure is disposed on the encapsulation layer and is electrically connected to the plurality of conductive posts. Therefore, the multilayer composite materials for the conductive posts achieve CTE (coefficient of thermal expansion) matching, improve electrical conductivity, and prevent copper diffusion in high temperature or high frequency working environments. A manufacturing method of the electronic package is also provided.