Mounting Body, Ultrasonic Sensor, And Multi-Feed Detection Device
卷宗概要
发明人
Masayoshi YAMADA; Hikaru IWAI; Eiji OSAWA; Kiichi TAKEDA
IPC 分类
CPC 分类
The circuit substrateincludes the first wiring layerelectrically coupled to the circuit, the element substrateincludes a first substrate, a diaphragm, a piezoelectric element, the second substrate, and a second wiring layerelectrically coupled with the piezoelectric element, and it includes the third wiring layercoupled with the first wiring layerand second wiring layer, and the protectorthat covers the third wiring layer
原文（中文）
The circuit substrateincludes the first wiring layerelectrically coupled to the circuit, the element substrateincludes a first substrate, a diaphragm, a piezoelectric element, the second substrate, and a second wiring layerelectrically coupled with the piezoelectric element, and it includes the third wiring layercoupled with the first wiring layerand second wiring layer, and the protectorthat covers the third wiring layer