ELECTRONIC DEVICE ANTENNA USING HEAT SINK COMPONENTS
개요
출원인
Microsoft Technology Licensing, LLC
발명자
Sneha Rajeev SONDUR; Marc HARPER; Chulmin HAN
IPC 분류
CPC 분류
An electronic device includes one or more processing components that generate heat during operation. A heat sink is thermally coupled with the one or more processing components, such that the heat sink assembly dissipates at least a portion of the heat generated by the one or more processing components, wherein one or more components of the heat sink assembly are spaced away from a conductive chassis wall of the electronic device to form a cavity. An antenna feed line is disposed within the cavity, such that the antenna feed line and the cavity collectively form a cavity-backed slot-type antenna usable to transmit radio frequency (RF) signals.
원문 (중국어)
An electronic device includes one or more processing components that generate heat during operation. A heat sink is thermally coupled with the one or more processing components, such that the heat sink assembly dissipates at least a portion of the heat generated by the one or more processing components, wherein one or more components of the heat sink assembly are spaced away from a conductive chassis wall of the electronic device to form a cavity. An antenna feed line is disposed within the cavity, such that the antenna feed line and the cavity collectively form a cavity-backed slot-type antenna usable to transmit radio frequency (RF) signals.