METHOD OF FABRICATING SEMICONDUCTOR MEMORY DEVICE
Dossier Overview
Applicant
Samsung Electronics Co., Ltd.
Inventor
Yong Jae LEE; Seul Ji SONG
IPC Classification
CPC Classification
A method of fabricating a semiconductor memory device includes forming a first electrode on a substrate; forming an OTS film on the first electrode; forming a second electrode on the OTS film. The OTS film includes a first surface that is in contact with the first electrode and a second surface that is in contact with the second electrode. An area of the first surface and an area of the second surface are different from each other.
Original (Chinese)
A method of fabricating a semiconductor memory device includes forming a first electrode on a substrate; forming an OTS film on the first electrode; forming a second electrode on the OTS film. The OTS film includes a first surface that is in contact with the first electrode and a second surface that is in contact with the second electrode. An area of the first surface and an area of the second surface are different from each other.
External Resources