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SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

InventionPending
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20Claims · 3 independent
§ Ⅰ

Dossier Overview

Inventor

Ya-Ling Lee; Wei-Gang Chiu; Han-Ting Tsai; Chung-Te Lin

IPC Classification

H10D 30/67H1L 21/443H10D 64/1H10D 64/62H10D 99/

CPC Classification

H10D30/6729H1L21/443H10D64/1H10D64/62H10D99/H10D30/6755

A semiconductor device includes a substrate, a gate electrode, a gate dielectric layer, a channel layer, a source electrode and a drain electrode. The gate electrode is disposed over the substrate. The gate dielectric layer is disposed over the gate electrode. The channel layer is disposed over the gate dielectric layer. The source electrode and the drain electrode are disposed over the channel layer and beside the gate electrode. In some embodiments, each of the source electrode and the drain electrode includes a glue layer and a metal pattern, and a thickness of the glue layer adjacent to a sidewall of the metal pattern is greater than a thickness of the glue layer adjacent to a bottom of the metal pattern.

Original (Chinese)

A semiconductor device includes a substrate, a gate electrode, a gate dielectric layer, a channel layer, a source electrode and a drain electrode. The gate electrode is disposed over the substrate. The gate dielectric layer is disposed over the gate electrode. The channel layer is disposed over the gate dielectric layer. The source electrode and the drain electrode are disposed over the channel layer and beside the gate electrode. In some embodiments, each of the source electrode and the drain electrode includes a glue layer and a metal pattern, and a thickness of the glue layer adjacent to a sidewall of the metal pattern is greater than a thickness of the glue layer adjacent to a bottom of the metal pattern.

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