一种车载电子元器件高低温阶梯焊接工艺
本发明涉及电子元件焊接工艺技术领域,具体涉及一种车载电子元器件高低温阶梯焊接工艺;包括以下步骤:为PCB板设计车载功率元器件焊盘与温敏元器件焊盘,设计与PCB板相适配的钢网,车载专用锡膏印刷,车载功率元器件、温敏元器件自动贴装,三阶温度回流焊接,焊接完成后去应力退火,超声波设备清洗,依次进行外观检测、焊接强度检测和温变循环检测。本发明既保护了温敏元器件,又保证了车载功率元器件的焊接强度,同时有效防止了PCB板翘曲,提高了产品良率。
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