一种MiniLEDPCB钻孔工艺
本发明属于PCB板加工技术领域,具体涉及一种MiniLEDPCB钻孔工艺。包括以下步骤:PCB的开料与预处理;预处理板件的钻孔工艺;钻孔后处理工艺。本发明以BT树脂基覆铜板为基材制备MiniLEDPCB,通过“纳米固体润滑膜—水溶性保护膜”双层预处理与“紫外激光预钻孔—啄钻式机械精孔”分段成孔工艺的协同配合,能够有效避免超薄板钻孔过程中易出现的微钻头折断、孔口铜箔翻卷毛刺及孔壁树脂熔融钻污的问题,从而在厚度超薄BT基板上实现了高可靠性、高良率的微小孔径加工。
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