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安徽铜冠铜箔集团股份有限公司

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№ CN122918677AInvention
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一种铜箔表面处理用辊筒下压装置

本发明涉及铜箔生产技术领域，公开了一种铜箔表面处理用辊筒下压装置，包括固定组件、第一、第二、第三调节组件及控制器。第一调节组件通过丝杆机构实现移动底板沿第一方向平移；第二调节组件通过绕移动底板摆动的摇臂提供摆动行程；第三调节组件在摇臂动力输出端设置第二丝杆机构及张力传感器，驱动压制辊端部沿第二方向位移。控制器独立获取两端张力传感器实际张力并比较，基于比较结果控制摇臂动作，调节压制辊两端相对导电辊位置，使两端实际张力相等并维持在预设范围内。本发明解耦调节行程与精度，兼顾铜箔换型与高精度定位，构成两端独立闭环差动调节，在连续电镀过程中自动修正两端张力偏差，实现张力动态平衡，提升电镀质量一致性。

❖安徽铜冠铜箔集团股份有限公司; 铜陵铜冠电子铜箔有限公司; 合肥铜冠电子铜箔有限公司印大维; 顾伟伟; 李超; 王同; 郑小伟; 汪光志; 华睿清; 丛浩; 何磊; 龙文昊; 关浩Oct 16, 2026§ 1/10 ClaimsC25D 17/00 (2006.01), C25D 7/06 (2006.01)