陶瓷覆铜板及其制备方法
本发明提供一陶瓷覆铜板及其制造方法,其中所述陶瓷覆铜板的制备方法按时间顺序先后电镀一第一铜层和一第二铜层并依次于电镀后分别进行一低温热处理和一高温热处理,保障了铜层与陶瓷基板之间的结合强度,降低所述陶瓷覆铜板的空洞率,使所述陶瓷覆铜板的空洞率趋近于零。
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